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  • Analysis of Process Method for Manufacturing E/DMOS Circuits by Ion Implantation

    Ion implantation method to manufacture E/DMOS circuit analysis, it is much more difficult to manufacture enhanced and depleted MOS devices with the same channel on the same substrate, that is, E/D typ

    2020.12.3

    Analysis of Process Method for Manufacturing E/DMOS Circuits by Ion Implantation

    Ion implantation method to manufacture E/DMOS circuit analysis, it is much more difficult to manufacture enhanced and depleted MOS devices with the same channel on the same substrate, that is, E/D typ

    2020.12.3

  • SOS technology manufacturing CMOS circuit process analysis

    SOS technology manufacturing CMOS circuit process analysis, SOS technology is the abbreviation of "Epitaxial Silicon on Sapphire". This technique is to epitaxially grow a thin layer of silicon single

    2020.12.3

    SOS technology manufacturing CMOS circuit process analysis

    SOS technology manufacturing CMOS circuit process analysis, SOS technology is the abbreviation of "Epitaxial Silicon on Sapphire". This technique is to epitaxially grow a thin layer of silicon single

    2020.12.3

  • Analysis of CMOS Circuit Manufactured by Ion Implantation

    Ion implantation method for manufacturing CMOS circuit analysis, in the conventional process, the P-well region is formed by light boron diffusion, and the error of the diffusion concentration is rela

    2020.12.3

    Analysis of CMOS Circuit Manufactured by Ion Implantation

    Ion implantation method for manufacturing CMOS circuit analysis, in the conventional process, the P-well region is formed by light boron diffusion, and the error of the diffusion concentration is rela

    2020.12.3

  • CMOS process flow and process conditions analysis

    CMOS process, CMOS process flow, CMOS circuit is a combination of P-channel devices and N-channel devices. It has outstanding advantages such as high speed, low power consumption, and strong anti-inte

    2020.12.2

    CMOS process flow and process conditions analysis

    CMOS process, CMOS process flow, CMOS circuit is a combination of P-channel devices and N-channel devices. It has outstanding advantages such as high speed, low power consumption, and strong anti-inte

    2020.12.2

  • Detailed explanation of AMOS process method and basic process

    AMOS process, AMOS process flow, 1. The main features of AI2O3 AMOS process is a process that uses a SiO2-AI2O3 double-layer structure as the gate dielectric for MOS devices. The use of this process i

    2020.12.2

    Detailed explanation of AMOS process method and basic process

    AMOS process, AMOS process flow, 1. The main features of AI2O3 AMOS process is a process that uses a SiO2-AI2O3 double-layer structure as the gate dielectric for MOS devices. The use of this process i

    2020.12.2

  • Detailed explanation of NMOS devices and process methods and processes

    NMOS process, NMOS process devices, NMOS process is a process that uses SiO2-Si3N4 double-layer structure as the gate dielectric of MOS devices. This process is mainly based on the fact that silicon n

    2020.12.1

    Detailed explanation of NMOS devices and process methods and processes

    NMOS process, NMOS process devices, NMOS process is a process that uses SiO2-Si3N4 double-layer structure as the gate dielectric of MOS devices. This process is mainly based on the fact that silicon n

    2020.12.1

  • Ion implantation method for manufacturing MOS source and drain regions to achieve gate self-alignment

    The MOS source and drain regions realize gate self-alignment and self-alignment mosfet. The source and drain regions of the MOS device are fabricated by ion implantation, and the gate self-alignment c

    2020.11.30

    Ion implantation method for manufacturing MOS source and drain regions to achieve gate self-alignment

    The MOS source and drain regions realize gate self-alignment and self-alignment mosfet. The source and drain regions of the MOS device are fabricated by ion implantation, and the gate self-alignment c

    2020.11.30

  • Threshold voltage VT ion implantation adjustment method of MOS device

    The application of VT of MOS devices, in the MOS process, ion implantation technology can not only be used to make NMOS or PMOS source and drain regions and CMOS P-well regions, but also can control a

    2020.11.27

    Threshold voltage VT ion implantation adjustment method of MOS device

    The application of VT of MOS devices, in the MOS process, ion implantation technology can not only be used to make NMOS or PMOS source and drain regions and CMOS P-well regions, but also can control a

    2020.11.27

  • Process steps and characteristics of isoplanar silicon gate N-channel MOS process

    N-channel MOS, silicon gate N-channel MOS technology, N-channel and other planar processes, also known as "selective oxidation MOS technology", its characteristic is that a certain part of the silicon

    2020.11.27

    Process steps and characteristics of isoplanar silicon gate N-channel MOS process

    N-channel MOS, silicon gate N-channel MOS technology, N-channel and other planar processes, also known as "selective oxidation MOS technology", its characteristic is that a certain part of the silicon

    2020.11.27

  • P-channel silicon gate multi-product process flow and its layout design

    The P-channel "silicon gate process" has more characteristics for the performance of devices and integrated circuits than the conventional aluminum gate process. "Silicon gate process" has more charac

    2020.11.26

    P-channel silicon gate multi-product process flow and its layout design

    The P-channel "silicon gate process" has more characteristics for the performance of devices and integrated circuits than the conventional aluminum gate process. "Silicon gate process" has more charac

    2020.11.26

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Products
Field effect tube
Low current MOS tube
Super Junction Field Effect Transistor
Three-terminal regulator tube
Fast recovery diode
Silicon Carbide Field Effect Transistor
Silicon carbide diode
Application Field
Switching Power Supply
Adapter
Inverter
Vehicle Electronics
Communication Equipment
Services
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Technical Article
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Products
Field effect tube Low current MOS tube Super Junction Field Effect Transistor Three-terminal regulator tube Fast recovery diode Silicon Carbide Field Effect Transistor Silicon carbide diode
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Company Dynamics Industry Information
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